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(6月12日16:00)Nanoscale Heat Transfer: Thermal Conductivity of Hybrid Organic-Inorganic Materials

副标题:


报告题目:

Nanoscale Heat Transfer: Thermal Conductivity of Hybrid Organic-Inorganic Materials

报告人:                     Ronggui Yang

Department of Mechanical Engineering

University of Colorado, Boulder, CO 80309, USA

时间:2015612(周五)  16: 00         

地点:中国科学院力学研究所主楼344会议室

 

报告摘要:

Thermal transport plays an important role in energy and information technologies. There have been significant progresses on the understanding of thermal conductivity and phonon transport mechanisms over the past 2 decades, owing much to the challenging needs in high efficiency energy conversion, high speed electronics, and high power lasers. In concurrence with such technical challenges, significant progresses in computational power makes first-principles prediction of materials possible. Ultrafast lasers can now probe materials both at sub-femtosecond timescale and at atomic or sub-nanometer length scale. In this seminar, Dr. Yang will quickly highlight a few notable accomplishments in the field within the context of establishing multiscale-multiphysics simulation and characterization platforms for the study of phonon transport and thermal conductivity in nanostructured materials. Dr. Yang will introduce their works about the cross-plane thermal conductivity and volumetric heat capacity of three types of hybrid organic–inorganic zincone thin films fabricated by molecular layer deposition (MLD) and alternate atomic/molecular layer deposition (ALD/MLD)

报告人简介:

Dr. Ronggui Yang is the S.P. Chip and Lori Johnson Faculty Fellow in Engineering and an Associate Professor (started January 2006, and tenured at summer 2011) of Mechanical Engineering at the University of Colorado at Boulder. Dr. Yang received his Ph.D degree focusing on Nanoscale Transport Phenomena with Prof. Gang Chen in Mechanical Engineering and Professor Mildred S. Dresselhaus from MIT in February 2006. Prior to MIT, he had a Master’s degree in MEMS from UCLA in 2001, a Master’s degree in Engineering Thermophysics from Tsinghua University in 1999, and a Bachelor’s degree in Thermal Engineering from Xi’an Jiaotong University in 1996. His research interests are on the fundamentals of nanoscale transport phenomena and the applications of micro/nanotechnologies for energy conversion, storage and thermal management. Dr. Ronggui Yang has published more than 100 journal papers, and they are highly cited with a total citations > 3000 times, and an annual citation > 550 times per ISI Web of Science (SCI) since 2013. Dr. Yang is an active member of ASME and he is now a Guest Editor for ASME Journal of Electronic Packaging in charge of Invited Reviews. He is also currently an editorial board member for Scientific Reports.

报告联系人:沈楠  (office@lnm.imech.ac.cn 82543935)

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